Chip capability
It has perfect packaging technology, chip R&D technology, calibration system, etc., changing product application scenarios, adapting to market changes, fast product iteration speed, and wide application fields
Core technology
Core competitiveness
Technical features:
Industry applications
MEMS pressure bare die
MEMS pressure chips
Wafers, chips, modules
Wafers, chips, modules
Clean workshop
Cleanroom construction drawings
Part of the production equipment
Test verification equipment
Production load and product category
Quality control
01
/14Core technology
Level 2 and Level 3 comprehensive solutions
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Design: chips, structures, communications, testing, software, etc
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Processing: chip packaging, SMT, assembly, etc
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Tests: screening, aging, calibration, environmental tests, etc
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Engineering: pressure calibration line, packaging production line, etc
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Core competitiveness
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Technological advantagesPackaging technology + chip R&D technology + calibration system = chip company
The independent design and R&D capabilities of the industrial chain, and the core products such as vehicle-grade sensors, industrial-grade sensors, and consumer sensors have reached the domestic leading level
There are a few teams in China with large-scale production and packaging technology for vehicle specifications, with few competitors and high barriers -
Advantages of integrated operating modelProduct sales + technology output = solution provider
Product empowerment + solution design = customer stickiness
At the same time, it solves the problem of mass production of chips and fragmentation of downstream markets -
Product Advantages:Through the adjustment of technical parameters, change the product application scenarios, adapt to market changes, product iteration speed, wide application fields, can be used in automotive, industrial, medical, consumer and instrumentation and other fields, multi-scene applications, product stickiness.
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Customized services for chip design and overall sensor solutionsMEMS chip design platform and process development platform based on independent IP; Combined with customer application requirements, customized services can realize multi-parameter and multi-dimensional data collection, analysis and data platform construction, with low replicability and high technical requirements.
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MEMS sensor packaging solutionsThe fully autonomous automotive MEMS line packaging platform has high technical and market barriers, and can provide multi-chip packaging, PCB board level packaging, and ceramic board (shell) level packaging to meet the rapid switching between multiple types of products. The product iteration efficiency is high, the product types are rich, and the market is selective
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teamCoordinate and cooperate with the internal assembly company of the group company to introduce the application and technical requirements of end customers faster and more accurately, with a high degree of cooperation, accurate product definition, and improve customer satisfaction.
Technical features:
| Category | detail |
| MEMS chip features: | MEMS chip self-development, high reliability design, small integrated packaging, -40~150°C range, low temperature drift, rapid development of new products |
| Variety of applications | TMAP Intake Manifold Pressure Chip, S-TMAP Intake Air Pipe Pressure Chip, PCV Crankcase Ventilation Pressure Chip, EVAP Fuel Vapor Pressure Chip, DPS Dual Brake Pressure Chip, Diesel Filter Differential Pressure Chip, EBS Brake Pressure Chip, Desorption Pressure Chip, Vacuum Pressure Chip, Fuel Pressure Chip, Industrial Air Pressure Pressure Chip, White Electric Liquid Level Pressure Chip, Air Conditioner Outlet Pressure Chip, Ventilator Pressure Chip, Water Pipe Network Pressure Chip, Gas Pipe Network Pressure Chip |
| Client | Automotive manufacturing, OBD detection, industrial, consumer, medical, Internet of Things |
Industry applications
Professional-grade chip supplier, vehicle-grade quality, meeting front-loading requirements; Mastering the whole process technology such as design simulation, tape-out, packaging and testing, the accuracy, stability, temperature drift and other performance indicators have reached the same level abroad.
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Implement the IATF16949:2016 standard
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Automatic production line of products
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Independent packaging and testing capabilities
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Perfect experimental process
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Quickly provide technical support for product application development
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Help users optimize, design, and build
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MEMS Pressure Bare Die - Types and Ranges
| series | type | industry | Range |
| Absolute | Frontal absolute pressure chip | Passenger car | 100Kpa、500Kpa |
| Commercial vehicles | 300Kpa、600Kpa | ||
| motorcycle | 100Kpa | ||
| Differential pressure | Absolute pressure chip on the back | 2Mpa | - |
| 5Mpa | - | ||
| Micro-pressure differential pressure chips | Passenger car | ±40Kpa、±7Kpa | |
| medical | ±3.5Kpa | ||
| Medium pressure differential pressure chips | Commercial vehicles | ±7Kpa、±100Kpa、±200Kpa、±500Kpa | |
| Medium and high voltage differential pressure chips | industry | 1Mpa |
MEMS Pressure Chips - Applications
| series | industry | Range | sensor | -- |
| Absolute | Commercial vehicles | 300～ 500Kpa | China V standard | Turbocharged, naturally aspirated |
| China VI Standard | EGR side recent | |||
| Intake pressure of passenger cars | 120Kpa | Vacuum, naturally aspirated | - | |
| 165Kpa | Battery pack pressure | - | ||
| 250Kpa | Turbocharged | - | ||
| motorcycle | 115Kpa | National IV intake pressure | - | |
| Back-pressure chip mix series | 2Mpa | DPS dual-way brake barometric pressure sensor EBS brake pressure sensor Fuel pressure sensor |
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| 5Mpa | industry | - | ||
| Differential pressure | Commercial vehicles | ±7Kpa | Crankcase ventilation sensor Air filter differential pressure sensor for commercial vehicles |
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| ±100Kpa | Desorption pressure sensor | - | ||
| Passenger car | ±7Kpa | Fuel evaporation system sensors | - | |
| ±40Kpa | Hybrid fuel line pressure sensor | - | ||
| -- | ±3.5Kpa | medical | - | |
| ±7Kpa | Washing machines, dishwashers, water level detection of household appliances | - |
Wafers, chips, modules - applications
| specification | Wafers | grain | encapsulation | Variety of applications |
| 1psi |  |
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PCV crankcase ventilation pressure chip EVAP Fuel Vapor Pressure Chip Air filter differential pressure sensor Diesel filter differential pressure chip Ventilator pressure chip |
| 15psi |  |
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Exhaust differential pressure DPS |
| 50psi |  |
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Under development | White electric level pressure chip Industrial gauge pressure chips |
Wafers, Chips, Modules - Application 2
| specification | Wafers | grain | encapsulation | Variety of applications |
| 15psi |  |
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China V TMAP pressure sensor Motorcycle TMAP pressure sensor Desorption pressure chip Vacuum sensors |
| 80psi |  |
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China VI standard S-TMAP pressure sensor (Gold Plated PAD) |
| 150psi |  |
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TPMS Pressure Sensor DPS dual-way braking pressure chip |
| 800psi |  |
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Chassis lift pressure chip Gas temperature and pressure sensor EBS brake pressure sensor |
Clean workshop
The total area of the single floor is 1300 square meters, and there are two functional areas on the left and right, namely: the packaging and calibration workshop on the left; On the right is the assembly and testing workshop. The two workshops are built in strict accordance with the 10,000-level purification level, including independent functional areas: feeding inspection room, warehouse, packaging room, glue drying room, automatic calibration room, gold cutting and forming room, sorting and taping room, assembly and testing room, etc. Realize the coverage of the purification workshop from the entry of bare chips to the shipment of finished products, improve the reliability of equipment, maintain the stability of production, improve quality, and provide customers with higher quality products.
Cleanroom construction drawings
Part of the production equipment
| The name of the device | Image | The name of the device | Image | The name of the device | Image |
| 2*DW |  |
2*YW |  |
PLSMA |  |
| Vacuum oven |  |
oven |  |
High and low temperature chambers |  |
| Nitrogen cabinet |  |
UV degluing machine |  |
Dage4000 |  |
| Tool microscope |  |
Visible microscope |  |
3-dimensional microscope |  |
Test verification equipment
The laboratory established by Shengmei Technology is mainly aimed at the test and verification of chips and packages, integrating the resources of the sensing division of the group company, and the test verification can be extended to the assembly products, so as to achieve full coverage verification from the chip level to the assembly level, improve the quality of products, and provide customers with more reliable and stable products.
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999
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Hipot tester
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Reliability test equipment
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Rapid thermal shock test bench
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Rapid Thermal Shock Test Bench 2
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Production load and product category
| name | Product diagram | Variety of applications |
| TMAP |  |
Private frame molds Supporting tooling fixtures Mature and stable |
| EVAP |  |
Pin-pin replacement Special counterbore design Supporting tooling fixtures |
| Micromelting |  |
Glass microfused chips Encapsulation process Corrosion-resistant |
| S-TMAP |  |
Private frame molds Side air intake method Corrosion-resistant glue Adapt to the environment of China VI |
| Oil-filled core |  |
Special-shaped 8-sided structure Miniaturized design The process is complete |
| BPS |  |
New energy battery pack pressure Double-hole design Corrosion-resistant |
| S-TMAP |  |
Special split package Custom glue Corrosion-resistant Three generations of S-TMAP |
| DPF foundry |  |
Bosch replacement Sensata Replacement Scheme Special when rubber rings Mature and stable |
| Slightly differential pressure |  |
Reverse valve design Integrated packaging Ceramic substrate |
Quality control
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Quality Assurance QA mechanism
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Breakdown of MEMS pressure sensor chip development data
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Hipot tester
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To learn more about Sinopec's services, contact us now
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